Semiconductor laser chip package with encapsulated recess molded on substrate and method for forming same
US8791492B2 · kind B2 · utility
1Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2012 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Jul 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/858
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laminate leadless carrier package having a semiconductor chip mounted at the edge of a recess region in a substrate supporting the chip, the substrate having a plurality of conductive and dielectric layers, a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate. An encapsulation covers the laser chip, the wire bond, and at least a portion of the top surface of the substrate including the recess region. The encapsulation is an optically transparent molding compound. The package is arranged to be mounted as a side-looker and/or a top-looker.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.