Jesse E. Clark
2Patents
2h-index
5Co-inventors
30Inventor score
Filing activity: Nov 14, 1994 → Sep 9, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5594234A | Downset exposed die mount pad leadframe and package | Electricity | 51 | Expired |
| US6072230A | Exposed leadframe for semiconductor packages and bend forming method of fabrication | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.