Exposed leadframe for semiconductor packages and bend forming method of fabrication
US6072230A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1997 |
| Grant date | Jun 6, 2000 |
| Priority date | — |
| Expiry date | Sep 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a single piece leadframe that can be used in current semiconductor device production. The leadframe has a plurality of segments in a horizontal plane, a chip mount pad in a different horizontal plane, and another plurality of segments connecting said chip mount pad with said leadframe. The latter plurality of segments has a geometry designed so as to tolerate bending and stretching beyond the limit of simple elongation based upon the inherent material characteristics. The chip mount pad of said leadframe provides direct thermal contact to an external heat conductor or heat sink by being designed so as to extend through the encapsulating package. The exposed chip pad can also be used electrically as a ground connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.