Jigneshkumar P. Patel
4Patents
0h-index
15Co-inventors
28Inventor score
Filing activity: Jul 7, 2017 → Aug 22, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10815329B2 | Plasticized thermoset resin, and associated cured resin, method of curing, and article comprising cured resin | Chemistry; Metallurgy | 0 | Active |
| US11804470B2 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Electricity | 0 | Active |
| US10913844B2 | Plasticized thermoset resin, and associated cured resin, method of curing, and article comprising cured resin | Chemistry; Metallurgy | 0 | Active |
| US11235436B2 | Abrasive articles and methods of forming the same | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.