Jin A Lee
9Patents
5h-index
18Co-inventors
60Inventor score
Filing activity: Feb 24, 2000 → Jun 2, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6424023B1 | Leadframe for molded semiconductor package and semiconductor package made using the leadframe | Electricity | 13 | Expired |
| US10255855B2 | Pixel of an organic light emitting diode display device and organic light emitting diode display device | Electricity | 11 | Active |
| US7009283B1 | Nonexposed heat sink for semiconductor package | Electricity | 11 | Expired |
| US10997910B2 | Display device for performing internal compensation of a pixel | Physics | 8 | Active |
| US10170525B2 | Organic light emitting display device | Electricity | 5 | Active |
| US11362161B2 | Display device | Electricity | 1 | Active |
| US11967276B2 | Display device | Physics | 0 | Active |
| US11793031B2 | Display device | Electricity | 0 | Active |
| US11064603B2 | Electronic apparatus having package base substrate | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.