JIN-CHENG WU
4Patents
0h-index
9Co-inventors
24Inventor score
Filing activity: Nov 27, 2019 → Jun 20, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12101871B2 | Circuit board using thermocouple to dissipate generated heat and method for manufacturing the same | Electricity | 0 | Active |
| US11317506B2 | Circuit board with high light reflectivity and method for manufacturing the same | Electricity | 0 | Active |
| US11696393B2 | Method for manufacturing circuit board with high light reflectivity | Electricity | 0 | Active |
| US11757080B2 | Multi-sided light-emitting circuit board and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.