Circuit board using thermocouple to dissipate generated heat and method for manufacturing the same
US12101871B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 20, 2022 |
| Grant date | Sep 24, 2024 |
| Priority date | — |
| Expiry date | Feb 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10219
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.