Jinchuan Bai
2Patents
2h-index
1Co-inventors
24Inventor score
Filing activity: Aug 15, 2000 → Apr 18, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6326700A | Low profile semiconductor package and process for making the same | Electricity | 49 | Expired |
| US6683386B2 | Low profile optically-sensitive semiconductor package | Electricity | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.