Jing Li
3Patents
1h-index
13Co-inventors
37Inventor score
Filing activity: Apr 9, 2010 → Sep 9, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8860135B2 | Semiconductor structure having aluminum layer with high reflectivity | Electricity | 2 | Active |
| US8609228B2 | High performance sealable coextruded biaxially oriented polypropylene film | Emerging Cross-Sectional Technologies | 1 | Active |
| US9558996B2 | Method for filling trench with metal layer and semiconductor structure formed by using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.