Jiri Pecen
11Patents
11h-index
17Co-inventors
65Inventor score
Filing activity: Aug 10, 1983 → Apr 26, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6068539A | Wafer polishing device with movable window | Performing Operations; Transporting | 117 | Expired |
| US6111634A | Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing | Electricity | 103 | Expired |
| US4766324A | Particle detection method including comparison between sequential scans | Physics | 100 | Expired |
| US6254459A | Wafer polishing device with movable window | Performing Operations; Transporting | 86 | Expired |
| US4641967A | Particle position correlator and correlation method for a surface scanner | Physics | 75 | Expired |
| US6146248A | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher | Electricity | 73 | Expired |
| US6108091A | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing | Physics | 59 | Expired |
| US6261155A | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher | Electricity | 24 | Expired |
| US6621584B2 | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing | Physics | 20 | Expired |
| US4512659A | Apparatus for calibrating a surface scanner | Physics | 16 | Expired |
| US5083035A | Position location in surface scanning using interval timing between scan marks on test wafers | Physics | 12 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.