Joachim Bergmann
3Patents
2h-index
7Co-inventors
30Inventor score
Filing activity: Jul 31, 2008 → Oct 28, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8132465B1 | Sensor element placement for package stress compensation | Physics | 19 | Active |
| US9188501B2 | Method for testing the tightness of water conducting components in a housing | Physics | 3 | Active |
| US7822093B2 | Method and apparatus for changing the length of a laser pulse | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.