Patent · US Active

Sensor element placement for package stress compensation

US8132465B1 · kind B1 · utility

19Cited by

32References

21Claims

0Family size

Assignee

SILICON MICROSTRUCTURES, INC. · US

Inventors

Michael Doelle · Munich, DE
Joachim Bergmann · Jena, DE

Key dates

Filing date	Jul 31, 2008
Grant date	Mar 13, 2012
Priority date	—
Expiry date	Aug 27, 2030

Classification

Technology area (CPC G)Physics
CPC primaryG01L27/007
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk boundary. Sensors near the diaphragm-bulk are used to estimate package-induced stress. This estimation can then be used in calibrating package stress from pressure measurements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.