Joey Chiu
3Patents
3h-index
13Co-inventors
40Inventor score
Filing activity: Aug 1, 2003 → Sep 13, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7132369B2 | Method of forming a low-K dual damascene interconnect structure | Electricity | 12 | Expired |
| US7256134B2 | Selective etching of carbon-doped low-k dielectrics | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7435685B2 | Method of forming a low-K dual damascene interconnect structure | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.