John Fritche
2Patents
1h-index
12Co-inventors
34Inventor score
Filing activity: Oct 2, 2001 → Jun 24, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7030031B2 | Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material | Electricity | 53 | Expired |
| US6864180B2 | Method for reworking low-k polymers used in semiconductor structures | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.