John Hua
4Patents
1h-index
11Co-inventors
45Inventor score
Filing activity: Jun 21, 1995 → Nov 26, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5627108A | Solder paste and glue dot-based methods of securing components to a printed circuit board | Emerging Cross-Sectional Technologies | 24 | Expired |
| US8922222B2 | Systems and methods for determining electrical connectivity | Electricity | 1 | Active |
| US8633398B2 | Circuit board contact pads | Emerging Cross-Sectional Technologies | 1 | Active |
| US9645187B2 | Systems and methods for determining electrical connectivity | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.