Circuit board contact pads
US8633398B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2011 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Mar 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.