John Patrick Sprint
2Patents
2h-index
6Co-inventors
33Inventor score
Filing activity: Nov 17, 1997 → Jul 14, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5869353A | Modular panel stacking process | Electricity | 135 | Expired |
| US6856010B2 | Thin scale outline package | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.