John R. Behun
7Patents
5h-index
14Co-inventors
56Inventor score
Filing activity: May 4, 1989 → May 17, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5060844A | Interconnection structure and test method | Emerging Cross-Sectional Technologies | 143 | Expired |
| US5147084A | Interconnection structure and test method | Emerging Cross-Sectional Technologies | 137 | Expired |
| US4914814A | Process of fabricating a circuit package | Emerging Cross-Sectional Technologies | 104 | Expired |
| US6590278B1 | Electronic package | Electricity | 50 | Expired |
| US5565119A | Method and apparatus for soldering with a multiple tip and associated optical fiber heating device | Electricity | 31 | Expired |
| US5297618A | Apparatus for removing a heatsink from an electronic module or package | Electricity | 4 | Expired |
| US6683466B2 | Piston for module test | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.