Method and apparatus for soldering with a multiple tip and associated optical fiber heating device
US5565119A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1995 |
| Grant date | Oct 15, 1996 |
| Priority date | — |
| Expiry date | Apr 28, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3494
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A laser head for simultaneously attaching solder balls to a carrier has at least one solder tip, with the number of solder tips being equal to the number of solder balls to be attached to the carrier. Each solder tip is heated by an optical fiber in thermal contact with the tip at one end of the fiber and coupled to a laser, preferably operating in the infrared wavelength range, at the other end of the fiber via a multiplexer coupling device. A spring is used in association with each solder tip to bias each solder tip to hold the carrier in contact with the solder balls. The tip absorbs the radiant energy as it exits the optical fiber, and the tip is heated. The laser and multiplexer permit precise control over the heat imparted to the tip, which in turn permits control of the amount of the solder ball that is reflowed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.