John R. Kochilla
7Patents
5h-index
5Co-inventors
48Inventor score
Filing activity: Dec 19, 1997 → Nov 10, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6361823B1 | Process for whisker-free aqueous electroless tin plating | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6086779A | Copper etching compositions and method for etching copper | Chemistry; Metallurgy | 31 | Expired |
| US6284309A | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6720499B2 | Tin whisker-free printed circuit board | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6602440B2 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7101469B2 | Metal pieces and articles having improved corrosion resistance | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6579591B2 | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.