Copper etching compositions and method for etching copper
US6086779A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1999 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Mar 1, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/46
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to an aqueous etching composition for etching metallic copper comprising PA1 (a) an acid, PA1 (b) a copper complexing agent, PA1 (c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and PA1 (d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition. The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.