John Reitz
3Patents
2h-index
7Co-inventors
30Inventor score
Filing activity: Apr 19, 2002 → Jun 24, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6977057B2 | Embossing process | Physics | 15 | Expired |
| US6749905B1 | Method for hot stamping chalcogenide glass for infrared optical components | Chemistry; Metallurgy | 2 | Expired |
| US7147906B2 | Data storage medium comprising polyimides | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.