Embossing process
US6977057B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2002 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Sep 9, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/241
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for manufacturing an embossed surface including a polymer composition having reactive moieties and a first glass transition temperature of Tg1. The method includes embossing the surface at temperature Temb; and raising the first glass transition temperature Tg1 of the embossed polymeric surface to a second glass transition temperature Tg2 such that Tg2>Temb. In another embodiment, a method for improving the release of a polymeric surface from an embossing tool includes incorporating of one or more of fluorine atoms, silicon atoms, or siloxane segments into the backbone of the polymer. The methods are particularly suited for direct patterning of photoresists, fabrication of interdigitated electrodes, and fabrication of data storage media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.