John Robert Diroll
2Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Apr 6, 2006 → Jun 25, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7768075B2 | Semiconductor die packages using thin dies and metal substrates | Electricity | 6 | Expired |
| US8329508B2 | Semiconductor die packages using thin dies and metal substrates | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.