Semiconductor die packages using thin dies and metal substrates
US8329508B2 · kind B2 · utility
1Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2010 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Jun 25, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die package is disclosed. The semiconductor die package comprises a metal substrate, and a semiconductor die comprising a first surface comprising a first electrical terminal, a second surface including a second electrical terminal, and at least one aperture. The metal substrate is attached to the second surface. A plurality of conductive structures is on the semiconductor die, and includes at least one conductive structure disposed in the at least one aperture. Other conductive structures may be disposed on the first surface of the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.