Jong-Ung Lee
2Patents
1h-index
5Co-inventors
33Inventor score
Filing activity: Aug 6, 2004 → Feb 12, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7235887B2 | Semiconductor package with improved chip attachment and manufacturing method thereof | Electricity | 7 | Expired |
| US8829748B2 | Connecting molding for automation of three-phase motor winding | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.