Joonho Jun
4Patents
1h-index
6Co-inventors
30Inventor score
Filing activity: Jul 23, 2020 → Feb 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11222873B2 | Semiconductor packages including stacked substrates and penetration electrodes | Electricity | 1 | Active |
| US11935873B2 | Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips | Electricity | 0 | Active |
| US11688707B2 | Semiconductor package | Electricity | 0 | Active |
| US11621250B2 | Semiconductor packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.