Joy Watanabe
6Patents
5h-index
12Co-inventors
60Inventor score
Filing activity: Jun 25, 1998 → Feb 27, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11296053B2 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Electricity | 35 | Active |
| US6043146A | Process for forming a semiconductor device | Electricity | 34 | Expired |
| US6127258A | Method for forming a semiconductor device | Electricity | 30 | Expired |
| US6372665B1 | Method for forming a semiconductor device | Electricity | 6 | Expired |
| US11955463B2 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Electricity | 6 | Active |
| US12272677B2 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.