Ju-Shi Chen
3Patents
2h-index
12Co-inventors
34Inventor score
Filing activity: Jul 23, 2015 → May 17, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9728521B2 | Hybrid bond using a copper alloy for yield improvement | Electricity | 201 | Active |
| US9666566B1 | 3DIC structure and method for hybrid bonding semiconductor wafers | Electricity | 5 | Active |
| US9887182B2 | 3DIC structure and method for hybrid bonding semiconductor wafers | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.