Juergen Usner
1Patents
1h-index
1Co-inventors
22Inventor score
Filing activity: Nov 14, 2002 → Nov 14, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7207107B2 | Method and device for through-hole plating of substrates and printed circuit boards | Emerging Cross-Sectional Technologies | 19 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.