Method and device for through-hole plating of substrates and printed circuit boards
US7207107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2002 |
| Grant date | Apr 24, 2007 |
| Priority date | — |
| Expiry date | Dec 1, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0207
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for through-contacting flexible substrates 1, in particular circuit boards, having electrically conductive contact zones 4, 41 present on two opposing surfaces 1a, 1b of the substrate provides that a cut 11 is produced obliquely to the surfaces of the substrate in the area of the contact zones, and the two substrate areas 20, 30 adjoining the oblique cut are moved past each other until they lock behind each other. Moving them past each other is effected by a ram 12, by the action of compressed air 13, by applying a vacuum 14 or by a driving hook 15 fixed to the cutting tool. The two steps of producing the cut and moving the two substrate areas adjoining the cut past each other are effected in a common processing station, preferably in a single operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.