Jun Higuchi
3Patents
1h-index
5Co-inventors
37Inventor score
Filing activity: May 7, 2012 → Aug 2, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9506158B2 | Method for copper plating | Electricity | 9 | Active |
| US12128686B2 | Liquid ejecting apparatus | Performing Operations; Transporting | 0 | Active |
| US9988730B2 | Method of forming a metal layer and method of manufacturing a substrate having such metal layer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.