Patent · US Active

Method for copper plating

US9506158B2 · kind B2 · utility

9Cited by

2References

20Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Dirk Rohde · Berlin, DE
Bernd Roelfs · Berlin, DE
Jun Higuchi · Matsumoto, JP

Key dates

Filing date	May 7, 2012
Grant date	Nov 29, 2016
Priority date	—
Expiry date	Feb 6, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0733
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.