Junwei Chung
1Patents
0h-index
2Co-inventors
16Inventor score
Filing activity: Jan 9, 2017 → Jan 9, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10615320B2 | Recessed chip scale packaging light emitting device and manufacturing method of the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.