Recessed chip scale packaging light emitting device and manufacturing method of the same

US10615320B2 · kind B2 · utility

Assignee

• MAVEN OPTRONICS CO., LTD. · TW

Inventors

• Chieh Chen · Palo Alto, US
• Tsung-Hsi Wang · Hsinchu, TW
• Junwei Chung

Key dates

• Filing date: Jan 9, 2017
• Grant date: Apr 7, 2020
• Expiry date: Jan 9, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8506

Abstract

A chip-scale packaging (CSP) LED device, comprising an LED semiconductor die and a packaging structure, is disclosed. The LED semiconductor die is encapsulated by the packaging structure, wherein the lower surface of the packaging structure has a recessed space underneath. A manufacturing method of the CPS LED device is also disclosed.