Justin E. Stroup
3Patents
0h-index
8Co-inventors
27Inventor score
Filing activity: Aug 24, 2016 → Feb 12, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12108542B2 | System and method for creating orthogonal solder interconnects | Electricity | 0 | Active |
| US12032008B2 | System for contactless testing of radio frequency apertures | Emerging Cross-Sectional Technologies | 0 | Active |
| US10396461B2 | Low profile, ultra-wide band, low frequency modular phased array antenna with coincident phase center | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.