System and method for creating orthogonal solder interconnects
US12108542B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Oct 1, 2024 |
| Priority date | — |
| Expiry date | Nov 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.