Kana Uchimura
1Patents
0h-index
7Co-inventors
19Inventor score
Filing activity: Apr 3, 2020 → Apr 3, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11905412B2 | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.