Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package
US11905412B2 · kind B2 · utility
0Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2020 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Jul 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/012
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.