Kanji Kuba
3Patents
2h-index
5Co-inventors
27Inventor score
Filing activity: May 8, 2012 → Aug 22, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8882934B2 | Solder powder, and solder paste using solder powder | Emerging Cross-Sectional Technologies | 8 | Active |
| US9067800B2 | Method for manufacturing tin(II) oxide powder for replenishing tin component of tin-alloy plating solution, and tin (II) oxide powder manufactured using said method | Chemistry; Metallurgy | 3 | Active |
| US9108861B2 | Tin(II) oxide powder for replenishing tin component of tin-alloy plating solution and method for manufacturing said powder | Chemistry; Metallurgy | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.