Solder powder, and solder paste using solder powder
US8882934B2 · kind B2 · utility
8Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2012 |
| Grant date | Nov 11, 2014 |
| Priority date | — |
| Expiry date | Aug 22, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12028
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.