Ken Holcomb
1Patents
1h-index
—Co-inventors
19Inventor score
Filing activity: Dec 28, 2007 → Dec 28, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9003648B2 | Methods to produce high density, multilayer printed wiring boards from parallel-fabricated circuits and filled vias | Emerging Cross-Sectional Technologies | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.