Ken Ukawa
3Patents
1h-index
4Co-inventors
33Inventor score
Filing activity: Nov 1, 2005 → Feb 26, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7741388B2 | Epoxy resin composition and semiconductor device | Electricity | 4 | Expired |
| US9136194B2 | Resin composition for encapsulation and electronic device using the same | Electricity | 1 | Active |
| US7671146B2 | Epoxy resin composition for encapsulating semiconductor and semiconductor device | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.