Epoxy resin composition for encapsulating semiconductor and semiconductor device
US7671146B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2007 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Sep 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.