Kenjiro Ogata
1Patents
0h-index
5Co-inventors
19Inventor score
Filing activity: Jun 17, 2016 → Jun 17, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10722999B2 | High removal rate chemical mechanical polishing pads and methods of making | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.