Kenneth Patrick Reilich
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Oct 20, 2000 → Oct 20, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6271048A | Process for recycling a substrate from an integrated circuit package | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.