KeonSoo JANG
5Patents
1h-index
6Co-inventors
40Inventor score
Filing activity: Jun 2, 2009 → Aug 29, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9462736B2 | Composition and methods of forming solder bump and flip chip using the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US8420722B2 | Composition and methods of forming solder bump and flip chip using the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US9155236B2 | Composition and methods of forming solder bump and flip chip using the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US11107790B2 | Laser bonding method | Electricity | 0 | Active |
| US8802760B2 | Composition and methods of forming solder bump and flip chip using the same | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.