Composition and methods of forming solder bump and flip chip using the same
US9155236B2 · kind B2 · utility
0Cited by
5References
4Claims
0Family size
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Key dates
| Filing date | Jul 8, 2014 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Jul 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.