Kevin Hsia
1Patents
1h-index
7Co-inventors
25Inventor score
Filing activity: Jan 17, 2001 → Jan 17, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6521485B2 | Method for manufacturing wafer level chip size package | Electricity | 28 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.