Khoon Lam Chua
1Patents
1h-index
4Co-inventors
25Inventor score
Filing activity: Oct 1, 2010 → Oct 1, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8357565B2 | Integrated circuit package and a method for forming an integrated circuit package | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.